Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography
Abstract
We report for the first time the results of tensile stress testing of thin film conductive structures patterned by stencil lithography on a PI substrate. The goal of this investigation is to determine the effects that mechanical deformation occurring in real applications can have on electrical parameters of metal interconnects in flexible electronic circuits. The thickness of thin film gold conductors is of the order of 10 nm. while their lateral dimensions are in the micrometer range. Electrical parameters of thin film conductors are measured under uniaxial tensile stress and in the relaxed state after subjecting them to a number of stretching and relaxation cycles. SEM imaging of the test structures was used for observing of possible changes in thin film surface morphology caused by the applied tensile stress.
Keywords:
Flexible electronics / Stencil lithography / Polymer substrate / Flexible interconnects / Resistivity / Tensile stressSource:
Microelectronic Engineering, 2012, 98, 230-233Publisher:
- Elsevier
Funding / projects:
- Reinforcement of Regional Microsystems and Nanosystems Centre (EU-FP7-205533)
- Micro- Nanosystems and Sensors for Electric Power and Process Industry and Environmental Protection (RS-MESTD-Technological Development (TD or TR)-32008)
DOI: 10.1016/j.mee.2012.07.016
ISSN: 0167-9317
WoS: 000309497200048
Scopus: 2-s2.0-84865597276
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Institution/Community
IHTMTY - JOUR AU - Frantlović, Miloš AU - Jokić, Ivana AU - Savu, Veronica AU - Xie, Shenqi AU - Brugger, Juergen PY - 2012 UR - https://cer.ihtm.bg.ac.rs/handle/123456789/1133 AB - We report for the first time the results of tensile stress testing of thin film conductive structures patterned by stencil lithography on a PI substrate. The goal of this investigation is to determine the effects that mechanical deformation occurring in real applications can have on electrical parameters of metal interconnects in flexible electronic circuits. The thickness of thin film gold conductors is of the order of 10 nm. while their lateral dimensions are in the micrometer range. Electrical parameters of thin film conductors are measured under uniaxial tensile stress and in the relaxed state after subjecting them to a number of stretching and relaxation cycles. SEM imaging of the test structures was used for observing of possible changes in thin film surface morphology caused by the applied tensile stress. PB - Elsevier T2 - Microelectronic Engineering T1 - Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography VL - 98 SP - 230 EP - 233 DO - 10.1016/j.mee.2012.07.016 ER -
@article{ author = "Frantlović, Miloš and Jokić, Ivana and Savu, Veronica and Xie, Shenqi and Brugger, Juergen", year = "2012", abstract = "We report for the first time the results of tensile stress testing of thin film conductive structures patterned by stencil lithography on a PI substrate. The goal of this investigation is to determine the effects that mechanical deformation occurring in real applications can have on electrical parameters of metal interconnects in flexible electronic circuits. The thickness of thin film gold conductors is of the order of 10 nm. while their lateral dimensions are in the micrometer range. Electrical parameters of thin film conductors are measured under uniaxial tensile stress and in the relaxed state after subjecting them to a number of stretching and relaxation cycles. SEM imaging of the test structures was used for observing of possible changes in thin film surface morphology caused by the applied tensile stress.", publisher = "Elsevier", journal = "Microelectronic Engineering", title = "Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography", volume = "98", pages = "230-233", doi = "10.1016/j.mee.2012.07.016" }
Frantlović, M., Jokić, I., Savu, V., Xie, S.,& Brugger, J.. (2012). Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography. in Microelectronic Engineering Elsevier., 98, 230-233. https://doi.org/10.1016/j.mee.2012.07.016
Frantlović M, Jokić I, Savu V, Xie S, Brugger J. Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography. in Microelectronic Engineering. 2012;98:230-233. doi:10.1016/j.mee.2012.07.016 .
Frantlović, Miloš, Jokić, Ivana, Savu, Veronica, Xie, Shenqi, Brugger, Juergen, "Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography" in Microelectronic Engineering, 98 (2012):230-233, https://doi.org/10.1016/j.mee.2012.07.016 . .