CER - Central Repository
Institute of Chemistry, Technology and Metallurgy
    • English
    • Српски
    • Српски (Serbia)
  • English 
    • English
    • Serbian (Cyrillic)
    • Serbian (Latin)
  • Login
View Item 
  •   CER
  • IHTM
  • Radovi istraživača / Researchers' publications
  • View Item
  •   CER
  • IHTM
  • Radovi istraživača / Researchers' publications
  • View Item
JavaScript is disabled for your browser. Some features of this site may not work without it.

Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography

Authorized Users Only
2012
Authors
Frantlović, Miloš
Jokić, Ivana
Savu, Veronica
Xie, Shenqi
Brugger, Juergen
Article (Published version)
Metadata
Show full item record
Abstract
We report for the first time the results of tensile stress testing of thin film conductive structures patterned by stencil lithography on a PI substrate. The goal of this investigation is to determine the effects that mechanical deformation occurring in real applications can have on electrical parameters of metal interconnects in flexible electronic circuits. The thickness of thin film gold conductors is of the order of 10 nm. while their lateral dimensions are in the micrometer range. Electrical parameters of thin film conductors are measured under uniaxial tensile stress and in the relaxed state after subjecting them to a number of stretching and relaxation cycles. SEM imaging of the test structures was used for observing of possible changes in thin film surface morphology caused by the applied tensile stress.
Keywords:
Flexible electronics / Stencil lithography / Polymer substrate / Flexible interconnects / Resistivity / Tensile stress
Source:
Microelectronic Engineering, 2012, 98, 230-233
Publisher:
  • Elsevier
Funding / projects:
  • Reinforcement of Regional Microsystems and Nanosystems Centre (EU-205533)
  • Micro- Nanosystems and Sensors for Electric Power and Process Industry and Environmental Protection (RS-32008)

DOI: 10.1016/j.mee.2012.07.016

ISSN: 0167-9317

WoS: 000309497200048

Scopus: 2-s2.0-84865597276
[ Google Scholar ]
2
2
URI
https://cer.ihtm.bg.ac.rs/handle/123456789/1133
Collections
  • Radovi istraživača / Researchers' publications
Institution/Community
IHTM
TY  - JOUR
AU  - Frantlović, Miloš
AU  - Jokić, Ivana
AU  - Savu, Veronica
AU  - Xie, Shenqi
AU  - Brugger, Juergen
PY  - 2012
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/1133
AB  - We report for the first time the results of tensile stress testing of thin film conductive structures patterned by stencil lithography on a PI substrate. The goal of this investigation is to determine the effects that mechanical deformation occurring in real applications can have on electrical parameters of metal interconnects in flexible electronic circuits. The thickness of thin film gold conductors is of the order of 10 nm. while their lateral dimensions are in the micrometer range. Electrical parameters of thin film conductors are measured under uniaxial tensile stress and in the relaxed state after subjecting them to a number of stretching and relaxation cycles. SEM imaging of the test structures was used for observing of possible changes in thin film surface morphology caused by the applied tensile stress.
PB  - Elsevier
T2  - Microelectronic Engineering
T1  - Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography
VL  - 98
SP  - 230
EP  - 233
DO  - 10.1016/j.mee.2012.07.016
ER  - 
@article{
author = "Frantlović, Miloš and Jokić, Ivana and Savu, Veronica and Xie, Shenqi and Brugger, Juergen",
year = "2012",
abstract = "We report for the first time the results of tensile stress testing of thin film conductive structures patterned by stencil lithography on a PI substrate. The goal of this investigation is to determine the effects that mechanical deformation occurring in real applications can have on electrical parameters of metal interconnects in flexible electronic circuits. The thickness of thin film gold conductors is of the order of 10 nm. while their lateral dimensions are in the micrometer range. Electrical parameters of thin film conductors are measured under uniaxial tensile stress and in the relaxed state after subjecting them to a number of stretching and relaxation cycles. SEM imaging of the test structures was used for observing of possible changes in thin film surface morphology caused by the applied tensile stress.",
publisher = "Elsevier",
journal = "Microelectronic Engineering",
title = "Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography",
volume = "98",
pages = "230-233",
doi = "10.1016/j.mee.2012.07.016"
}
Frantlović, M., Jokić, I., Savu, V., Xie, S.,& Brugger, J.. (2012). Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography. in Microelectronic Engineering
Elsevier., 98, 230-233.
https://doi.org/10.1016/j.mee.2012.07.016
Frantlović M, Jokić I, Savu V, Xie S, Brugger J. Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography. in Microelectronic Engineering. 2012;98:230-233.
doi:10.1016/j.mee.2012.07.016 .
Frantlović, Miloš, Jokić, Ivana, Savu, Veronica, Xie, Shenqi, Brugger, Juergen, "Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography" in Microelectronic Engineering, 98 (2012):230-233,
https://doi.org/10.1016/j.mee.2012.07.016 . .

DSpace software copyright © 2002-2015  DuraSpace
About CeR – Central Repository | Send Feedback

re3dataOpenAIRERCUB
 

 

All of DSpaceInstitutions/communitiesAuthorsTitlesSubjectsThis institutionAuthorsTitlesSubjects

Statistics

View Usage Statistics

DSpace software copyright © 2002-2015  DuraSpace
About CeR – Central Repository | Send Feedback

re3dataOpenAIRERCUB