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Effects of tensile stress on electrical parameters of thin film conductive wires fabricated on a flexible substrate using stencil lithography

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2012
Authors
Frantlović, Miloš
Jokić, Ivana
Savu, Veronica
Xie, Shenqi
Brugger, Juergen
Article (Published version)
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Abstract
We report for the first time the results of tensile stress testing of thin film conductive structures patterned by stencil lithography on a PI substrate. The goal of this investigation is to determine the effects that mechanical deformation occurring in real applications can have on electrical parameters of metal interconnects in flexible electronic circuits. The thickness of thin film gold conductors is of the order of 10 nm. while their lateral dimensions are in the micrometer range. Electrical parameters of thin film conductors are measured under uniaxial tensile stress and in the relaxed state after subjecting them to a number of stretching and relaxation cycles. SEM imaging of the test structures was used for observing of possible changes in thin film surface morphology caused by the applied tensile stress.
Keywords:
Flexible electronics / Stencil lithography / Polymer substrate / Flexible interconnects / Resistivity / Tensile stress
Source:
Microelectronic Engineering, 2012, 98, 230-233
Publisher:
  • Elsevier Science Bv, Amsterdam
Projects:
  • Reinforcement of Regional Microsystems and Nanosystems Centre (EU-205533)
  • Micro- Nanosystems and Sensors for Electric Power and Process Industry and Environmental Protection (RS-32008)

DOI: 10.1016/j.mee.2012.07.016

ISSN: 0167-9317

WoS: 000309497200048

Scopus: 2-s2.0-84865597276
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URI
http://cer.ihtm.bg.ac.rs/handle/123456789/1133
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