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dc.creatorLamovec, Jelena
dc.creatorJović, Vesna
dc.creatorMladenović, Ivana
dc.creatorVorkapić, Miloš
dc.creatorPopović, Bogdan
dc.creatorRadojević, Vesna
dc.date.accessioned2019-01-30T17:32:25Z
dc.date.available2019-01-30T17:32:25Z
dc.date.issued2012
dc.identifier.issn2159-1660
dc.identifier.urihttp://cer.ihtm.bg.ac.rs/handle/123456789/1097
dc.description.abstractDifferent composite systems of electrodeposited monolayered and multilayered thin metal films of Ni and Cu on cold-rolled copper substrates were made. Thin metal layers were deposited at narrow spacing of 300 nm and 150 nm and high strength of composites was obtained. Microhardness analysis was performed on the systems of ED Ni film (sulphate "Slotonik 20" electrolyte) / ED Cu film (sulphate electrolyte), ED Ni film (sulphamate electrolyte) / ED Cu film (sulphate electrolyte) and ED Ni film (sulphamate electrolyte) /ED Ni film ("Slotonik 20" electrolyte). Characterization of mechanical properties of the composite systems was done using Vickers microhardness testing with loads ranging from 0.049 N to 1.96 N. Dependence of microhardness for different composite systems on microstructure and Ni/Cu and Ni/Ni layer thickness ratio was investigated. Composite hardness model of Korsunsky was applied to the experimental data in order to determine the absolute composite film hardness. The highest value of all the composite film hardness values was obtained for the system of multilayered Ni films from two different electrolytes, and "Slotonik 20" and sulphamate and with sublayer thickness ratio 1:2, respectively.en
dc.publisherInstitute of Electrical and Electronics Engineers Inc.
dc.relationinfo:eu-repo/grantAgreement/EC/FP7/205533/EU//
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/32008/RS//
dc.relationinfo:eu-repo/grantAgreement/MESTD/Technological Development (TD or TR)/34011/RS//
dc.relationinfo:eu-repo/grantAgreement/MESTD/Integrated and Interdisciplinary Research (IIR or III)/45019/RS//
dc.rightsrestrictedAccess
dc.source28th International Conference on Microelectronics - Proceedings, MIEL 2012
dc.titleComparative Microhardness Analysis of Various Thin Metallic Multilayer Composite Filmsen
dc.typeconferenceObject
dc.rights.licenseARR
dcterms.abstractЛамовец, Јелена; Воркапић, Милош; Јовић, Весна; Младеновић, Ивана; Поповић, Богдан; Радојевиц, В.;
dc.citation.spage143
dc.citation.epage146
dc.citation.other: 143-146
dc.identifier.doi10.1109/MIEL.2012.6222818
dc.identifier.rcubConv_2852
dc.identifier.scopus2-s2.0-84864243108
dc.identifier.wos000309119600028
dc.type.versionpublishedVersion


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