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Structural characteristics of bright copper surfaces
(Journal of Electroanalytical Chemistry, 2001)
In this work, the structures of copper surfaces polished mechanically and polished both mechanically and electrochemically, as well as copper coatings obtained in the presence of basic and top brightening addition agents ...
A contribution to the knowledge of electrochemical deposition of W induced by Ni
(Elsevier Sequoia SA, 2000)
It was found that codeposition of Ni and W from an ammonia and citrate-containing electrolyte, is very sensitive to changes in operating conditions. The Ni-W alloy deposit exhibited sensitivity of chemical composition and ...