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Identification of intermetallic compounds in electrodeposited copper-cadmium alloys by electrochemical techniques
(Elsevier, 1989)
Anodic sweep voltammetry was used to identify different intermetallic compounds and assess their amount in copper-cadmium alloys. Four compounds are found in thin (1–8 μm) electroplated alloy films: CuCd3, Cu5Cd8, Cu4Cd3 ...