Претраживање
Приказ резултата 1-3 од 3
Morphologies of copper deposits obtained by the electrodeposition at high overpotentials
(Elsevier, 2006)
Morphologies of copper deposits obtained at overpotentials belonging to the plateau of the limiting diffusion current density and at higher
overpotentials were examined by the scanning electron microscopy (SEM) technique. ...
Comparative reflection and structural analyses of copper and zinc coatings electrodeposited from acid sulfate solutions without and with additives
(Elsevier, 2002)
Reflection and structural analyses of different copper and zinc coatings were performed. The coatings of copper obtained were from acid sulfate solutions in the absence and presence of thiourea. The coatings of zinc were ...
Formation of dish-like holes and a channel structure in electrodeposition of copper under hydrogen co-deposition
(Elsevier, 2007)
Copper electrodeposition from acid sulfate solutions at an overpotential of 1000 mV, which is about 250 mV outside the plateau of the limiting diffusion current density, was examined by the determination of the average ...