TY  - CONF
AU  - Poljak, Predrag
AU  - Frantlović, Miloš
AU  - Vukelić, Branko
AU  - Randjelović, Danijela
AU  - Vorkapić, Miloš
AU  - Vasiljević-Radović, Dana
PY  - 2017
UR  - http://etran.etf.rs/index_e.html
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/3902
AB  - In order to improve the efficiency of the pressure sensors characterization process at the Center of Microelectronic Technologies (CMT), a new measurement setup is developed that enables fully automatic characterization of multiple silicon piezoresistive MEMS pressure sensors. The whole experiment, including high-performance measurement of sensors output signals at several temperature and pressure values, and storage of the measured results in a computer file, requires only a minimum of operator action. The setup consists of both hardware and software modules. The hardware is partly based on equipment designed and built at CMT for this purpose, and the software is entirely developed at CMT. This paper is focused on the software aspects of the developed experimental setup. The main objective of the presented work is to make the small series production of industrial pressure transmitters at CMT more efficient. The results are also very useful for research and development of pressure sensors and instrumentation.
PB  - Beograd : Društvo za ETRAN
PB  - Beograd : Akademska misao
C3  - Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, June 5-8, Kladovo, Serbia
T1  - A Software Application for Automatic Characterization of Piezoresistive MEMS Pressure Sensors
SP  - MOI2.2-1
EP  - MOI2.2-5
UR  - https://hdl.handle.net/21.15107/rcub_cer_3902
ER  - 

@conference{
author = "Poljak, Predrag and Frantlović, Miloš and Vukelić, Branko and Randjelović, Danijela and Vorkapić, Miloš and Vasiljević-Radović, Dana",
year = "2017",
abstract = "In order to improve the efficiency of the pressure sensors characterization process at the Center of Microelectronic Technologies (CMT), a new measurement setup is developed that enables fully automatic characterization of multiple silicon piezoresistive MEMS pressure sensors. The whole experiment, including high-performance measurement of sensors output signals at several temperature and pressure values, and storage of the measured results in a computer file, requires only a minimum of operator action. The setup consists of both hardware and software modules. The hardware is partly based on equipment designed and built at CMT for this purpose, and the software is entirely developed at CMT. This paper is focused on the software aspects of the developed experimental setup. The main objective of the presented work is to make the small series production of industrial pressure transmitters at CMT more efficient. The results are also very useful for research and development of pressure sensors and instrumentation.",
publisher = "Beograd : Društvo za ETRAN, Beograd : Akademska misao",
journal = "Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, June 5-8, Kladovo, Serbia",
title = "A Software Application for Automatic Characterization of Piezoresistive MEMS Pressure Sensors",
pages = "MOI2.2-1-MOI2.2-5",
url = "https://hdl.handle.net/21.15107/rcub_cer_3902"
}

Poljak, P., Frantlović, M., Vukelić, B., Randjelović, D., Vorkapić, M.,& Vasiljević-Radović, D.. (2017). A Software Application for Automatic Characterization of Piezoresistive MEMS Pressure Sensors. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, June 5-8, Kladovo, Serbia
Beograd : Društvo za ETRAN., MOI2.2-1-MOI2.2-5.
https://hdl.handle.net/21.15107/rcub_cer_3902

Poljak P, Frantlović M, Vukelić B, Randjelović D, Vorkapić M, Vasiljević-Radović D. A Software Application for Automatic Characterization of Piezoresistive MEMS Pressure Sensors. in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, June 5-8, Kladovo, Serbia. 2017;:MOI2.2-1-MOI2.2-5.
https://hdl.handle.net/21.15107/rcub_cer_3902 .

Poljak, Predrag, Frantlović, Miloš, Vukelić, Branko, Randjelović, Danijela, Vorkapić, Miloš, Vasiljević-Radović, Dana, "A Software Application for Automatic Characterization of Piezoresistive MEMS Pressure Sensors" in Proceedings of 4th International Conference on Electrical, Electronics and Computing Engineering, IcETRAN 2017, June 5-8, Kladovo, Serbia (2017):MOI2.2-1-MOI2.2-5,
https://hdl.handle.net/21.15107/rcub_cer_3902 .

TY  - JOUR
AU  - Frantlović, Miloš
AU  - Jokić, Ivana
AU  - Lazić, Žarko
AU  - Vukelić, Branko
AU  - Obradov, Marko
AU  - Vasiljević-Radović, Dana
AU  - Stanković, Srđan
PY  - 2015
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/1714
AB  - Temperature and pressure are the most common parameters to be measured and monitored not only in industrial processes but in many other fields from vehicles and healthcare to household appliances. Silicon microelectromechanical (MEMS) piezoresistive pressure sensors are the first and the most successful MEMS sensors, offering high sensitivity, solid-state reliability and small dimensions at a low cost achieved by mass production. The inherent temperature dependence of the output signal of such sensors adversely affects their pressure measurement performance, necessitating the use of correction methods in a majority of cases. However, the same effect can be utilized for temperature measurement, thus enabling new sensor applications. In this paper we perform characterization of MEMS piezoresistive pressure sensors for temperature measurement, propose a sensor correction method, and demonstrate that the measurement error as low as ± 0.3 °C can be achieved.
PB  - Univerzitet u Nišu
T2  - Facta universitatis - series: Electronics and Energetics
T1  - Temperature measurement performance of silicon piezoresistive MEMS pressure sensors for industrial applications
VL  - 28
IS  - 1
SP  - 123
EP  - 131
DO  - 10.2298/FUEE1501123F
ER  - 

@article{
author = "Frantlović, Miloš and Jokić, Ivana and Lazić, Žarko and Vukelić, Branko and Obradov, Marko and Vasiljević-Radović, Dana and Stanković, Srđan",
year = "2015",
abstract = "Temperature and pressure are the most common parameters to be measured and monitored not only in industrial processes but in many other fields from vehicles and healthcare to household appliances. Silicon microelectromechanical (MEMS) piezoresistive pressure sensors are the first and the most successful MEMS sensors, offering high sensitivity, solid-state reliability and small dimensions at a low cost achieved by mass production. The inherent temperature dependence of the output signal of such sensors adversely affects their pressure measurement performance, necessitating the use of correction methods in a majority of cases. However, the same effect can be utilized for temperature measurement, thus enabling new sensor applications. In this paper we perform characterization of MEMS piezoresistive pressure sensors for temperature measurement, propose a sensor correction method, and demonstrate that the measurement error as low as ± 0.3 °C can be achieved.",
publisher = "Univerzitet u Nišu",
journal = "Facta universitatis - series: Electronics and Energetics",
title = "Temperature measurement performance of silicon piezoresistive MEMS pressure sensors for industrial applications",
volume = "28",
number = "1",
pages = "123-131",
doi = "10.2298/FUEE1501123F"
}

Frantlović, M., Jokić, I., Lazić, Ž., Vukelić, B., Obradov, M., Vasiljević-Radović, D.,& Stanković, S.. (2015). Temperature measurement performance of silicon piezoresistive MEMS pressure sensors for industrial applications. in Facta universitatis - series: Electronics and Energetics
Univerzitet u Nišu., 28(1), 123-131.
https://doi.org/10.2298/FUEE1501123F

Frantlović M, Jokić I, Lazić Ž, Vukelić B, Obradov M, Vasiljević-Radović D, Stanković S. Temperature measurement performance of silicon piezoresistive MEMS pressure sensors for industrial applications. in Facta universitatis - series: Electronics and Energetics. 2015;28(1):123-131.
doi:10.2298/FUEE1501123F .

Frantlović, Miloš, Jokić, Ivana, Lazić, Žarko, Vukelić, Branko, Obradov, Marko, Vasiljević-Radović, Dana, Stanković, Srđan, "Temperature measurement performance of silicon piezoresistive MEMS pressure sensors for industrial applications" in Facta universitatis - series: Electronics and Energetics, 28, no. 1 (2015):123-131,
https://doi.org/10.2298/FUEE1501123F . .

TY  - CONF
AU  - Frantlović, Miloš
AU  - Jokić, Ivana
AU  - Lazić, Žarko
AU  - Vukelic, B.
AU  - Obradov, Marko
AU  - Vasiljević-Radović, Dana
PY  - 2014
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/1452
AB  - In industrial processes, as well as in many other fields from vehicles to healthcare, temperature and pressure are the most common parameters to be measured and monitored. Silicon microelectromechanical (MEMS) piezoresistive pressure sensors are the first and the most successful MEMS sensors, widely used in the industry in various measurement configurations. The inherent temperature dependence of the output signal of such sensors adversely affects their pressure measurement performance. However, it can be utilized for temperature measurement, thus enabling new sensor applications. In this paper a method is presented for temperature measurement using MEMS piezoresistive pressure sensors.
PB  - Institute of Electrical and Electronics Engineers Inc.
C3  - Proceedings of the International Conference on Microelectronics, ICM
T1  - Temperature Measurement Using Silicon Piezoresistive MEMS Pressure Sensors
SP  - 159
EP  - 161
DO  - 10.1109/MIEL.2014.6842110
ER  - 

@conference{
author = "Frantlović, Miloš and Jokić, Ivana and Lazić, Žarko and Vukelic, B. and Obradov, Marko and Vasiljević-Radović, Dana",
year = "2014",
abstract = "In industrial processes, as well as in many other fields from vehicles to healthcare, temperature and pressure are the most common parameters to be measured and monitored. Silicon microelectromechanical (MEMS) piezoresistive pressure sensors are the first and the most successful MEMS sensors, widely used in the industry in various measurement configurations. The inherent temperature dependence of the output signal of such sensors adversely affects their pressure measurement performance. However, it can be utilized for temperature measurement, thus enabling new sensor applications. In this paper a method is presented for temperature measurement using MEMS piezoresistive pressure sensors.",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
journal = "Proceedings of the International Conference on Microelectronics, ICM",
title = "Temperature Measurement Using Silicon Piezoresistive MEMS Pressure Sensors",
pages = "159-161",
doi = "10.1109/MIEL.2014.6842110"
}

Frantlović, M., Jokić, I., Lazić, Ž., Vukelic, B., Obradov, M.,& Vasiljević-Radović, D.. (2014). Temperature Measurement Using Silicon Piezoresistive MEMS Pressure Sensors. in Proceedings of the International Conference on Microelectronics, ICM
Institute of Electrical and Electronics Engineers Inc.., 159-161.
https://doi.org/10.1109/MIEL.2014.6842110

Frantlović M, Jokić I, Lazić Ž, Vukelic B, Obradov M, Vasiljević-Radović D. Temperature Measurement Using Silicon Piezoresistive MEMS Pressure Sensors. in Proceedings of the International Conference on Microelectronics, ICM. 2014;:159-161.
doi:10.1109/MIEL.2014.6842110 .

Frantlović, Miloš, Jokić, Ivana, Lazić, Žarko, Vukelic, B., Obradov, Marko, Vasiljević-Radović, Dana, "Temperature Measurement Using Silicon Piezoresistive MEMS Pressure Sensors" in Proceedings of the International Conference on Microelectronics, ICM (2014):159-161,
https://doi.org/10.1109/MIEL.2014.6842110 . .

TY  - GEN
AU  - Jović, Vesna
AU  - Lamovec, Jelena
AU  - Mladenović, Ivana
AU  - Smiljanić, Milče M.
AU  - Todorović, Dragan
AU  - Lazić, Žarko
AU  - Popović, Bogdan
AU  - Vukelić, Branko
PY  - 2013
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/5725
AB  - Двостраним анизотропним влажним нагризањем формиране су микрогредице на
монокристалним Si подлогама (100) оријентације поступцима запреминског
микромашинства.
PB  - University of Belgrade - Institute of Chemistry, Technology and Metallurgy
T1  - Реализација силицијумских микрогредица за фотоакустична мерења
UR  - https://hdl.handle.net/21.15107/rcub_cer_5725
ER  - 

@misc{
author = "Jović, Vesna and Lamovec, Jelena and Mladenović, Ivana and Smiljanić, Milče M. and Todorović, Dragan and Lazić, Žarko and Popović, Bogdan and Vukelić, Branko",
year = "2013",
abstract = "Двостраним анизотропним влажним нагризањем формиране су микрогредице на
монокристалним Si подлогама (100) оријентације поступцима запреминског
микромашинства.",
publisher = "University of Belgrade - Institute of Chemistry, Technology and Metallurgy",
title = "Реализација силицијумских микрогредица за фотоакустична мерења",
url = "https://hdl.handle.net/21.15107/rcub_cer_5725"
}

Jović, V., Lamovec, J., Mladenović, I., Smiljanić, M. M., Todorović, D., Lazić, Ž., Popović, B.,& Vukelić, B.. (2013). Реализација силицијумских микрогредица за фотоакустична мерења. 
University of Belgrade - Institute of Chemistry, Technology and Metallurgy..
https://hdl.handle.net/21.15107/rcub_cer_5725

Jović V, Lamovec J, Mladenović I, Smiljanić MM, Todorović D, Lazić Ž, Popović B, Vukelić B. Реализација силицијумских микрогредица за фотоакустична мерења. 2013;.
https://hdl.handle.net/21.15107/rcub_cer_5725 .

Jović, Vesna, Lamovec, Jelena, Mladenović, Ivana, Smiljanić, Milče M., Todorović, Dragan, Lazić, Žarko, Popović, Bogdan, Vukelić, Branko, "Реализација силицијумских микрогредица за фотоакустична мерења" (2013),
https://hdl.handle.net/21.15107/rcub_cer_5725 .

TY  - GEN
AU  - Smiljanić, Milče M.
AU  - Lazić, Žarko
AU  - Jović, Vesna
AU  - Radulović, Katarina
AU  - Vukelić, Branko
AU  - Popović, Bogdan
AU  - Vasiljević-Radović, Dana
PY  - 2012
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/5805
AB  - Primena tehnike maskless nagrizanja u vodenom rastvoru TMAH je novi tehnološki postupak 
u realizaciji različitih senzora pritiska. Tehnika maskless nagrizanja omogućava dobijanje 
trodimenzionalnih silicijumskih struktura na više nivoa koji su na različitim dubinama. 
Osnova maskless tehnike su dve termičke oksidacije koje formiraju silicijum diokside znatno 
različitih debljina i dva fotolitografska postupka. Glavni princip maskless tehnike je da se 
posle prvog dela nagrizanja do određene dubine skida drugi tanki silicijum dioksid, a 
zatim se nastavlja drugi deo nagrizanja do formiranja željene strukture.
PB  - University of Belgrade - Institute of Chemistry, Technology and Metallurgy
T1  - Primena tehnike maskless nagrizanja u vodenom rastvoru TMAH u realizaciji SOI SP-11 i usavršavanju SP-9 i SP-12 senzora pritisaka
UR  - https://hdl.handle.net/21.15107/rcub_cer_5805
ER  - 

@misc{
author = "Smiljanić, Milče M. and Lazić, Žarko and Jović, Vesna and Radulović, Katarina and Vukelić, Branko and Popović, Bogdan and Vasiljević-Radović, Dana",
year = "2012",
abstract = "Primena tehnike maskless nagrizanja u vodenom rastvoru TMAH je novi tehnološki postupak 
u realizaciji različitih senzora pritiska. Tehnika maskless nagrizanja omogućava dobijanje 
trodimenzionalnih silicijumskih struktura na više nivoa koji su na različitim dubinama. 
Osnova maskless tehnike su dve termičke oksidacije koje formiraju silicijum diokside znatno 
različitih debljina i dva fotolitografska postupka. Glavni princip maskless tehnike je da se 
posle prvog dela nagrizanja do određene dubine skida drugi tanki silicijum dioksid, a 
zatim se nastavlja drugi deo nagrizanja do formiranja željene strukture.",
publisher = "University of Belgrade - Institute of Chemistry, Technology and Metallurgy",
title = "Primena tehnike maskless nagrizanja u vodenom rastvoru TMAH u realizaciji SOI SP-11 i usavršavanju SP-9 i SP-12 senzora pritisaka",
url = "https://hdl.handle.net/21.15107/rcub_cer_5805"
}

Smiljanić, M. M., Lazić, Ž., Jović, V., Radulović, K., Vukelić, B., Popović, B.,& Vasiljević-Radović, D.. (2012). Primena tehnike maskless nagrizanja u vodenom rastvoru TMAH u realizaciji SOI SP-11 i usavršavanju SP-9 i SP-12 senzora pritisaka. 
University of Belgrade - Institute of Chemistry, Technology and Metallurgy..
https://hdl.handle.net/21.15107/rcub_cer_5805

Smiljanić MM, Lazić Ž, Jović V, Radulović K, Vukelić B, Popović B, Vasiljević-Radović D. Primena tehnike maskless nagrizanja u vodenom rastvoru TMAH u realizaciji SOI SP-11 i usavršavanju SP-9 i SP-12 senzora pritisaka. 2012;.
https://hdl.handle.net/21.15107/rcub_cer_5805 .

Smiljanić, Milče M., Lazić, Žarko, Jović, Vesna, Radulović, Katarina, Vukelić, Branko, Popović, Bogdan, Vasiljević-Radović, Dana, "Primena tehnike maskless nagrizanja u vodenom rastvoru TMAH u realizaciji SOI SP-11 i usavršavanju SP-9 i SP-12 senzora pritisaka" (2012),
https://hdl.handle.net/21.15107/rcub_cer_5805 .

TY  - JOUR
AU  - Jović, Vesna
AU  - Matić, Milan J.
AU  - Vukelić, Branko M.
AU  - Starčević, Marko 
AU  - Smiljanić, Milče
AU  - Lamovec, Jelena
AU  - Vorkapić, Miloš
PY  - 2011
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/892
AB  - This paper gives comparison and discussion of adhesives used for attachment of silicon piezoresistive pressure sensor dies. Special attention is paid to low pressure sensor dies because of their extreme sensitivity on stresses, which can arise from packaging procedure and applied materials. Commercially available adhesives 'Scotch Weld 2214 Hi-Temp' from '3M Co.' and 'DM2700P/H848' from 'DIEMAT', USA, were compared. The first is an aluminum filled epoxy adhesive and the second is a low melting temperature (LMT) glass paste. Comparing test results for low pressure sensor chips we found that LMT glass (glass frit) is a better adhesive for this application. Applying LMT glass paste minimizes internal stresses caused by disagreement of coefficients of thermal expansions between the sensor die and the housing material. Also, it minimizes stresses introduced during applying external loads in the process of pressure measuring. Regarding the measurements, for the sensors installed with filled epoxy paste, the resistor for compensation of temperature offset change had negative values in all cases, which means that linear temperature compensation of sensors installed this way would be impossible. In the sensors installed with LMT glass paste, all results, without exception, were in their common limits (values), which gives the possibility of passive temperature compensation. Furthermore, LMT glass attachment can broaden temperature operating range of MEM silicon pressure sensors towards higher values, up to 120°C.
AB  - U ovom radu se porede i diskutuju adhezivi koji su korišćeni za montažu čipova silicijumskih piezorezistivnih senzora pritiska. Posebna pažnja je poklonjena montaži čipova senzora za niske pritiske ( LT 1 bar) zbog toga što su oni posebno osetljivi na naprezanja koja nastaju kao posledica samog procesa montaže i karakteristika primenjenih materijala. Za montažu čipa na kućište su korišćeni komercijalno dostupni adhezivi 'Scotch Weld 2214 Hi-Temp' proizvođača '3M Co.' i 'DM2700P/H848' proizvođača 'DIEMAT', SAD. Prvi adheziv je epoksidna pasta sa česticama aluminijuma kao puniocem, a drugi je pasta stakla sa niskom temperaturom topljenja. Poredeći karakteristike montiranih čipova piezorezistivnih MEM senzora niskog pritiska, pokazano je da je za ovu primenu montaže pogodnije koristiti pastu stakla sa niskom temperaturom topljenja, jer senzori montirani primenom ovog adheziva mogu da se pasivno temperaturno kompenzuju i ta kompenzacija je vrlo stabilna. Montaža senzora ovim adhezivom pruža mogućnost rada senzora i na povišenim temperaturama do 120°C.
PB  - Association of Chemical Engineers of Serbia
T2  - Hemijska industrija
T1  - Attachment of MEM piezoresistive silicon pressure sensor dies using different adhesives
T1  - Montaža čipova MEM silicijumskih piezorezistivnih senzora pritiska primenom različitih adheziva
VL  - 65
IS  - 5
SP  - 497
EP  - 505
DO  - 10.2298/HEMIND110509044J
ER  - 

@article{
author = "Jović, Vesna and Matić, Milan J. and Vukelić, Branko M. and Starčević, Marko  and Smiljanić, Milče and Lamovec, Jelena and Vorkapić, Miloš",
year = "2011",
abstract = "This paper gives comparison and discussion of adhesives used for attachment of silicon piezoresistive pressure sensor dies. Special attention is paid to low pressure sensor dies because of their extreme sensitivity on stresses, which can arise from packaging procedure and applied materials. Commercially available adhesives 'Scotch Weld 2214 Hi-Temp' from '3M Co.' and 'DM2700P/H848' from 'DIEMAT', USA, were compared. The first is an aluminum filled epoxy adhesive and the second is a low melting temperature (LMT) glass paste. Comparing test results for low pressure sensor chips we found that LMT glass (glass frit) is a better adhesive for this application. Applying LMT glass paste minimizes internal stresses caused by disagreement of coefficients of thermal expansions between the sensor die and the housing material. Also, it minimizes stresses introduced during applying external loads in the process of pressure measuring. Regarding the measurements, for the sensors installed with filled epoxy paste, the resistor for compensation of temperature offset change had negative values in all cases, which means that linear temperature compensation of sensors installed this way would be impossible. In the sensors installed with LMT glass paste, all results, without exception, were in their common limits (values), which gives the possibility of passive temperature compensation. Furthermore, LMT glass attachment can broaden temperature operating range of MEM silicon pressure sensors towards higher values, up to 120°C., U ovom radu se porede i diskutuju adhezivi koji su korišćeni za montažu čipova silicijumskih piezorezistivnih senzora pritiska. Posebna pažnja je poklonjena montaži čipova senzora za niske pritiske ( LT 1 bar) zbog toga što su oni posebno osetljivi na naprezanja koja nastaju kao posledica samog procesa montaže i karakteristika primenjenih materijala. Za montažu čipa na kućište su korišćeni komercijalno dostupni adhezivi 'Scotch Weld 2214 Hi-Temp' proizvođača '3M Co.' i 'DM2700P/H848' proizvođača 'DIEMAT', SAD. Prvi adheziv je epoksidna pasta sa česticama aluminijuma kao puniocem, a drugi je pasta stakla sa niskom temperaturom topljenja. Poredeći karakteristike montiranih čipova piezorezistivnih MEM senzora niskog pritiska, pokazano je da je za ovu primenu montaže pogodnije koristiti pastu stakla sa niskom temperaturom topljenja, jer senzori montirani primenom ovog adheziva mogu da se pasivno temperaturno kompenzuju i ta kompenzacija je vrlo stabilna. Montaža senzora ovim adhezivom pruža mogućnost rada senzora i na povišenim temperaturama do 120°C.",
publisher = "Association of Chemical Engineers of Serbia",
journal = "Hemijska industrija",
title = "Attachment of MEM piezoresistive silicon pressure sensor dies using different adhesives, Montaža čipova MEM silicijumskih piezorezistivnih senzora pritiska primenom različitih adheziva",
volume = "65",
number = "5",
pages = "497-505",
doi = "10.2298/HEMIND110509044J"
}

Jović, V., Matić, M. J., Vukelić, B. M., Starčević, M., Smiljanić, M., Lamovec, J.,& Vorkapić, M.. (2011). Attachment of MEM piezoresistive silicon pressure sensor dies using different adhesives. in Hemijska industrija
Association of Chemical Engineers of Serbia., 65(5), 497-505.
https://doi.org/10.2298/HEMIND110509044J

Jović V, Matić MJ, Vukelić BM, Starčević M, Smiljanić M, Lamovec J, Vorkapić M. Attachment of MEM piezoresistive silicon pressure sensor dies using different adhesives. in Hemijska industrija. 2011;65(5):497-505.
doi:10.2298/HEMIND110509044J .

Jović, Vesna, Matić, Milan J., Vukelić, Branko M., Starčević, Marko , Smiljanić, Milče, Lamovec, Jelena, Vorkapić, Miloš, "Attachment of MEM piezoresistive silicon pressure sensor dies using different adhesives" in Hemijska industrija, 65, no. 5 (2011):497-505,
https://doi.org/10.2298/HEMIND110509044J . .