TY  - JOUR
AU  - Jović, Vladimir D.
AU  - Despić, Aleksandar R.
AU  - Stevanović, Jasmina S.
AU  - Spaić, S.
PY  - 1989
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/6830
AB  - Anodic sweep voltammetry was used to identify different intermetallic compounds and assess their amount in copper-cadmium alloys. Four compounds are found in thin (1–8 μm) electroplated alloy films: CuCd3, Cu5Cd8, Cu4Cd3 and Cu2Cd. Their presence is reflected in four peaks recorded in the voltammograms, the fifth peak corresponding to dissolution of copper remaining after dissolution of cadmium. For quantitative assessment potential-step technique was also used, avoiding the problem of overlap of peaks. Indications were obtained that the first peak is a mixture of pure cadmium and the cadmium rich compound. Since changes in voltammograms with time of resting of the alloy in an inert atmosphere were found, they were ascribed to solid state reactions of formation of compounds richer in copper from the one richer in cadmium (or pure cadmium) and pure copper. Thermodynamics of alloy formation was considered and approximate values of the standard potentials and standard free energies of the compounds are evaluated.
PB  - Elsevier
T2  - Electrochimica Acta
T1  - Identification of intermetallic compounds in electrodeposited copper-cadmium alloys by electrochemical techniques
VL  - 34
IS  - 8
SP  - 1093
EP  - 1102
DO  - 10.1016/0013-4686(89)87141-5
ER  - 

@article{
author = "Jović, Vladimir D. and Despić, Aleksandar R. and Stevanović, Jasmina S. and Spaić, S.",
year = "1989",
abstract = "Anodic sweep voltammetry was used to identify different intermetallic compounds and assess their amount in copper-cadmium alloys. Four compounds are found in thin (1–8 μm) electroplated alloy films: CuCd3, Cu5Cd8, Cu4Cd3 and Cu2Cd. Their presence is reflected in four peaks recorded in the voltammograms, the fifth peak corresponding to dissolution of copper remaining after dissolution of cadmium. For quantitative assessment potential-step technique was also used, avoiding the problem of overlap of peaks. Indications were obtained that the first peak is a mixture of pure cadmium and the cadmium rich compound. Since changes in voltammograms with time of resting of the alloy in an inert atmosphere were found, they were ascribed to solid state reactions of formation of compounds richer in copper from the one richer in cadmium (or pure cadmium) and pure copper. Thermodynamics of alloy formation was considered and approximate values of the standard potentials and standard free energies of the compounds are evaluated.",
publisher = "Elsevier",
journal = "Electrochimica Acta",
title = "Identification of intermetallic compounds in electrodeposited copper-cadmium alloys by electrochemical techniques",
volume = "34",
number = "8",
pages = "1093-1102",
doi = "10.1016/0013-4686(89)87141-5"
}

Jović, V. D., Despić, A. R., Stevanović, J. S.,& Spaić, S.. (1989). Identification of intermetallic compounds in electrodeposited copper-cadmium alloys by electrochemical techniques. in Electrochimica Acta
Elsevier., 34(8), 1093-1102.
https://doi.org/10.1016/0013-4686(89)87141-5

Jović VD, Despić AR, Stevanović JS, Spaić S. Identification of intermetallic compounds in electrodeposited copper-cadmium alloys by electrochemical techniques. in Electrochimica Acta. 1989;34(8):1093-1102.
doi:10.1016/0013-4686(89)87141-5 .

Jović, Vladimir D., Despić, Aleksandar R., Stevanović, Jasmina S., Spaić, S., "Identification of intermetallic compounds in electrodeposited copper-cadmium alloys by electrochemical techniques" in Electrochimica Acta, 34, no. 8 (1989):1093-1102,
https://doi.org/10.1016/0013-4686(89)87141-5 . .