TY  - JOUR
AU  - Pavlović, Miomir G.
AU  - Kindlova, Š.
AU  - Roušar, Ivo
PY  - 1992
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/4735
AB  - It is shown that the critical overpotential of dendritic growth initiation increases with increasing copper concentration under identical hydrodynamic conditions, as well as with increasing rotation speed to the rde (rotating disc electrode).
PB  - Elsevier
T2  - Electrochimica Acta
T1  - The initiation of dendritic growth of electrodeposited copper on a rotating disc electrode with changing copper concentration and diffusion layer thickness
VL  - 37
IS  - 1
SP  - 23
EP  - 27
DO  - 10.1016/0013-4686(92)80006-8
ER  - 

@article{
author = "Pavlović, Miomir G. and Kindlova, Š. and Roušar, Ivo",
year = "1992",
abstract = "It is shown that the critical overpotential of dendritic growth initiation increases with increasing copper concentration under identical hydrodynamic conditions, as well as with increasing rotation speed to the rde (rotating disc electrode).",
publisher = "Elsevier",
journal = "Electrochimica Acta",
title = "The initiation of dendritic growth of electrodeposited copper on a rotating disc electrode with changing copper concentration and diffusion layer thickness",
volume = "37",
number = "1",
pages = "23-27",
doi = "10.1016/0013-4686(92)80006-8"
}

Pavlović, M. G., Kindlova, Š.,& Roušar, I.. (1992). The initiation of dendritic growth of electrodeposited copper on a rotating disc electrode with changing copper concentration and diffusion layer thickness. in Electrochimica Acta
Elsevier., 37(1), 23-27.
https://doi.org/10.1016/0013-4686(92)80006-8

Pavlović MG, Kindlova Š, Roušar I. The initiation of dendritic growth of electrodeposited copper on a rotating disc electrode with changing copper concentration and diffusion layer thickness. in Electrochimica Acta. 1992;37(1):23-27.
doi:10.1016/0013-4686(92)80006-8 .

Pavlović, Miomir G., Kindlova, Š., Roušar, Ivo, "The initiation of dendritic growth of electrodeposited copper on a rotating disc electrode with changing copper concentration and diffusion layer thickness" in Electrochimica Acta, 37, no. 1 (1992):23-27,
https://doi.org/10.1016/0013-4686(92)80006-8 . .