TY  - JOUR
AU  - Nikolić, Nebojša D.
AU  - Popov, Konstantin I.
AU  - Pavlovic, LJ
AU  - Pavlović, Miomir
PY  - 2006
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/268
AB  - The effect of hydrogen codeposition on the morphology of copper electrodeposits was studied. The dependences of the overall current and the volume of evolved hydrogen on the quantity of electricity used were plotted and the average current efficiencies of the evolved hydrogen were derived from them. The morphologies of copper electrodeposits were correlated with the hydrogen evolution rates. It was shown that dendrites are the main characteristic of deposits obtained at overpotentials belonging to the limiting diffusion current density plateau, at which the hydrogen evolution rate is low. At larger overpotentials the dominant form become craters in the honeycomb-like electrodeposits due to the intensive hydrogen codeposition.
PB  - Elsevier
T2  - Journal of Electroanalytical Chemistry
T1  - The effect of hydrogen codeposition on the morphology of copper electrodeposits. 1. The concept of effective overpotential
VL  - 588
IS  - 1
SP  - 88
EP  - 98
DO  - 10.1016/j.jelechem.2005.12.006
ER  - 

@article{
author = "Nikolić, Nebojša D. and Popov, Konstantin I. and Pavlovic, LJ and Pavlović, Miomir",
year = "2006",
abstract = "The effect of hydrogen codeposition on the morphology of copper electrodeposits was studied. The dependences of the overall current and the volume of evolved hydrogen on the quantity of electricity used were plotted and the average current efficiencies of the evolved hydrogen were derived from them. The morphologies of copper electrodeposits were correlated with the hydrogen evolution rates. It was shown that dendrites are the main characteristic of deposits obtained at overpotentials belonging to the limiting diffusion current density plateau, at which the hydrogen evolution rate is low. At larger overpotentials the dominant form become craters in the honeycomb-like electrodeposits due to the intensive hydrogen codeposition.",
publisher = "Elsevier",
journal = "Journal of Electroanalytical Chemistry",
title = "The effect of hydrogen codeposition on the morphology of copper electrodeposits. 1. The concept of effective overpotential",
volume = "588",
number = "1",
pages = "88-98",
doi = "10.1016/j.jelechem.2005.12.006"
}

Nikolić, N. D., Popov, K. I., Pavlovic, L.,& Pavlović, M.. (2006). The effect of hydrogen codeposition on the morphology of copper electrodeposits. 1. The concept of effective overpotential. in Journal of Electroanalytical Chemistry
Elsevier., 588(1), 88-98.
https://doi.org/10.1016/j.jelechem.2005.12.006

Nikolić ND, Popov KI, Pavlovic L, Pavlović M. The effect of hydrogen codeposition on the morphology of copper electrodeposits. 1. The concept of effective overpotential. in Journal of Electroanalytical Chemistry. 2006;588(1):88-98.
doi:10.1016/j.jelechem.2005.12.006 .

Nikolić, Nebojša D., Popov, Konstantin I., Pavlovic, LJ, Pavlović, Miomir, "The effect of hydrogen codeposition on the morphology of copper electrodeposits. 1. The concept of effective overpotential" in Journal of Electroanalytical Chemistry, 588, no. 1 (2006):88-98,
https://doi.org/10.1016/j.jelechem.2005.12.006 . .

TY  - JOUR
AU  - Pavlović, Miomir
AU  - Popov, Konstantin I.
AU  - Krstić, Snežana B.
AU  - Pavlovic, LJ
AU  - Ivanović, Evica
PY  - 2005
UR  - https://cer.ihtm.bg.ac.rs/handle/123456789/176
AB  - The surface structure of powder particles, which allows free flow of copper powder, was examined. It has been shown that a sufficiently dense surface structure which permits free flow will be obtained if apparent density is higher than 2.2 - 2.3 g/cm(3). Such a surface structure can be obtained by reversing current electrodeposition of powder at considerably lower apparent densities of powder due to selective dissolution of subparticles during anodic time of reversing current wave. The surface structure of copper powder particles is discussed and correlated with the lowest apparent density at which the copper powder can still flow.
PB  - Trans Tech Publications Ltd, Durnten-Zurich
T2  - Current Research in Advanced Materials and Processes
T1  - Flowability of electrolytic copper powder
VL  - 494
SP  - 247
EP  - 252
DO  - 10.4028/www.scientific.net/MSF.494.247
ER  - 

@article{
author = "Pavlović, Miomir and Popov, Konstantin I. and Krstić, Snežana B. and Pavlovic, LJ and Ivanović, Evica",
year = "2005",
abstract = "The surface structure of powder particles, which allows free flow of copper powder, was examined. It has been shown that a sufficiently dense surface structure which permits free flow will be obtained if apparent density is higher than 2.2 - 2.3 g/cm(3). Such a surface structure can be obtained by reversing current electrodeposition of powder at considerably lower apparent densities of powder due to selective dissolution of subparticles during anodic time of reversing current wave. The surface structure of copper powder particles is discussed and correlated with the lowest apparent density at which the copper powder can still flow.",
publisher = "Trans Tech Publications Ltd, Durnten-Zurich",
journal = "Current Research in Advanced Materials and Processes",
title = "Flowability of electrolytic copper powder",
volume = "494",
pages = "247-252",
doi = "10.4028/www.scientific.net/MSF.494.247"
}

Pavlović, M., Popov, K. I., Krstić, S. B., Pavlovic, L.,& Ivanović, E.. (2005). Flowability of electrolytic copper powder. in Current Research in Advanced Materials and Processes
Trans Tech Publications Ltd, Durnten-Zurich., 494, 247-252.
https://doi.org/10.4028/www.scientific.net/MSF.494.247

Pavlović M, Popov KI, Krstić SB, Pavlovic L, Ivanović E. Flowability of electrolytic copper powder. in Current Research in Advanced Materials and Processes. 2005;494:247-252.
doi:10.4028/www.scientific.net/MSF.494.247 .

Pavlović, Miomir, Popov, Konstantin I., Krstić, Snežana B., Pavlovic, LJ, Ivanović, Evica, "Flowability of electrolytic copper powder" in Current Research in Advanced Materials and Processes, 494 (2005):247-252,
https://doi.org/10.4028/www.scientific.net/MSF.494.247 . .