Electrodeposition of copper on glassy carbon and palladium from choline chloride - ethylene glycol deep eutectic solvent
Само за регистроване кориснике
2024
Аутори
Cvetković, Vesna S.Jović, Vladimir D.
Nikolić, Nebojša D.
Barudžija, Tanja S.
Dimitrijević, Silvana B.
Jovićević, Jovan N.
Чланак у часопису (Објављена верзија)
Метаподаци
Приказ свих података о документуАпстракт
Electrodeposition of copper from deep eutectic solvents (DES) based on a mixture of choline chloride and
ethylene glycol containing CuCl2⋅2H2O at 50 ◦C and 80 ◦C was studied. Electrochemical reduction/oxidation of
Cu(II)/Cu(0) on glassy carbon (GC) and palladium (Pd) electrodes was investigated by cyclic voltammetry (CV)
and square wave voltammetry (SWV) emphasizing that this process takes place through two steps, Cu(II) ↔ Cu(I)
and Cu(I) ↔ Cu(0). The CV results showed that in chloride-rich DES electrolytes, the increased presence of chloro
ligands raises the overpotential required for Cu electrodeposition. The electrochemical impedance spectroscopy
(EIS) results indicate simultaneous electrodeposition of Cu and electrosorption of large cations on electrodeposited
Cu on both GC and Pd substrates. Scanning electron microscopy (SEM) results showed that Cu grains of
approximately 1 μm were obtained by electrodeposition of Cu on both Pd and GC, whereby better coverage by
electrode...posited Cu was obtained on Pd than on GC. Cu electrodeposited on Pd was relatively uniform and
smooth, but porous, while Cu electrodeposited on GC was dispersed in small agglomerates. Energy-dispersive Xray
spectroscopy (EDS) of Cu electrodeposited on Pd detected the dominant presence of Cu with the possibility of
the formation of CuPd alloy. The presence of CuPd alloy face-centred cubic structures is confirmed by X-ray
diffraction (XRD) along with metallic Cu.
Кључне речи:
Copper electrodeposition / Choline chloride – ethylene glycol / CuPd alloys / ChCl(Cu) electrosorption / Morphology StructureИзвор:
Journal of Electroanalytical Chemistry, 2024, 958, 118161-Издавач:
- Elsevier
Финансирање / пројекти:
- Министарство науке, технолошког развоја и иновација Републике Србије, институционално финансирање - 200026 (Универзитет у Београду, Институт за хемију, технологију и металургију - ИХТМ) (RS-MESTD-inst-2020-200026)
Институција/група
IHTMTY - JOUR AU - Cvetković, Vesna S. AU - Jović, Vladimir D. AU - Nikolić, Nebojša D. AU - Barudžija, Tanja S. AU - Dimitrijević, Silvana B. AU - Jovićević, Jovan N. PY - 2024 UR - https://cer.ihtm.bg.ac.rs/handle/123456789/7572 AB - Electrodeposition of copper from deep eutectic solvents (DES) based on a mixture of choline chloride and ethylene glycol containing CuCl2⋅2H2O at 50 ◦C and 80 ◦C was studied. Electrochemical reduction/oxidation of Cu(II)/Cu(0) on glassy carbon (GC) and palladium (Pd) electrodes was investigated by cyclic voltammetry (CV) and square wave voltammetry (SWV) emphasizing that this process takes place through two steps, Cu(II) ↔ Cu(I) and Cu(I) ↔ Cu(0). The CV results showed that in chloride-rich DES electrolytes, the increased presence of chloro ligands raises the overpotential required for Cu electrodeposition. The electrochemical impedance spectroscopy (EIS) results indicate simultaneous electrodeposition of Cu and electrosorption of large cations on electrodeposited Cu on both GC and Pd substrates. Scanning electron microscopy (SEM) results showed that Cu grains of approximately 1 μm were obtained by electrodeposition of Cu on both Pd and GC, whereby better coverage by electrodeposited Cu was obtained on Pd than on GC. Cu electrodeposited on Pd was relatively uniform and smooth, but porous, while Cu electrodeposited on GC was dispersed in small agglomerates. Energy-dispersive Xray spectroscopy (EDS) of Cu electrodeposited on Pd detected the dominant presence of Cu with the possibility of the formation of CuPd alloy. The presence of CuPd alloy face-centred cubic structures is confirmed by X-ray diffraction (XRD) along with metallic Cu. PB - Elsevier T2 - Journal of Electroanalytical Chemistry T1 - Electrodeposition of copper on glassy carbon and palladium from choline chloride - ethylene glycol deep eutectic solvent VL - 958 SP - 118161 DO - 10.1016/j.jelechem.2024.118161 ER -
@article{ author = "Cvetković, Vesna S. and Jović, Vladimir D. and Nikolić, Nebojša D. and Barudžija, Tanja S. and Dimitrijević, Silvana B. and Jovićević, Jovan N.", year = "2024", abstract = "Electrodeposition of copper from deep eutectic solvents (DES) based on a mixture of choline chloride and ethylene glycol containing CuCl2⋅2H2O at 50 ◦C and 80 ◦C was studied. Electrochemical reduction/oxidation of Cu(II)/Cu(0) on glassy carbon (GC) and palladium (Pd) electrodes was investigated by cyclic voltammetry (CV) and square wave voltammetry (SWV) emphasizing that this process takes place through two steps, Cu(II) ↔ Cu(I) and Cu(I) ↔ Cu(0). The CV results showed that in chloride-rich DES electrolytes, the increased presence of chloro ligands raises the overpotential required for Cu electrodeposition. The electrochemical impedance spectroscopy (EIS) results indicate simultaneous electrodeposition of Cu and electrosorption of large cations on electrodeposited Cu on both GC and Pd substrates. Scanning electron microscopy (SEM) results showed that Cu grains of approximately 1 μm were obtained by electrodeposition of Cu on both Pd and GC, whereby better coverage by electrodeposited Cu was obtained on Pd than on GC. Cu electrodeposited on Pd was relatively uniform and smooth, but porous, while Cu electrodeposited on GC was dispersed in small agglomerates. Energy-dispersive Xray spectroscopy (EDS) of Cu electrodeposited on Pd detected the dominant presence of Cu with the possibility of the formation of CuPd alloy. The presence of CuPd alloy face-centred cubic structures is confirmed by X-ray diffraction (XRD) along with metallic Cu.", publisher = "Elsevier", journal = "Journal of Electroanalytical Chemistry", title = "Electrodeposition of copper on glassy carbon and palladium from choline chloride - ethylene glycol deep eutectic solvent", volume = "958", pages = "118161", doi = "10.1016/j.jelechem.2024.118161" }
Cvetković, V. S., Jović, V. D., Nikolić, N. D., Barudžija, T. S., Dimitrijević, S. B.,& Jovićević, J. N.. (2024). Electrodeposition of copper on glassy carbon and palladium from choline chloride - ethylene glycol deep eutectic solvent. in Journal of Electroanalytical Chemistry Elsevier., 958, 118161. https://doi.org/10.1016/j.jelechem.2024.118161
Cvetković VS, Jović VD, Nikolić ND, Barudžija TS, Dimitrijević SB, Jovićević JN. Electrodeposition of copper on glassy carbon and palladium from choline chloride - ethylene glycol deep eutectic solvent. in Journal of Electroanalytical Chemistry. 2024;958:118161. doi:10.1016/j.jelechem.2024.118161 .
Cvetković, Vesna S., Jović, Vladimir D., Nikolić, Nebojša D., Barudžija, Tanja S., Dimitrijević, Silvana B., Jovićević, Jovan N., "Electrodeposition of copper on glassy carbon and palladium from choline chloride - ethylene glycol deep eutectic solvent" in Journal of Electroanalytical Chemistry, 958 (2024):118161, https://doi.org/10.1016/j.jelechem.2024.118161 . .