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Neposredno elektrohemijsko taloženje prevlaka bakra na aluminijum

dc.creatorTomić, Milorad V.
dc.creatorPavlović, Ljubica J.
dc.creatorPavlović, Miomir
dc.date.accessioned2019-01-30T17:13:11Z
dc.date.available2019-01-30T17:13:11Z
dc.date.issued2005
dc.identifier.issn0351-9465
dc.identifier.urihttp://cer.ihtm.bg.ac.rs/handle/123456789/200
dc.description.abstractThe deposition of copper coatings has been done by direct electrochemical deposition from the solution: CuSO4 (55 g/dm3) + CH2 NH2 - CH2OH (100 g/dm3) + (NH4)2SO4 (30 g/dm3) + Na2SO4*10H2O (75 g/dm3) + Na2CO3 (3 g/dm3), room temperature, j = 0.3 - 0.8 A/dm2, pH = 10.3. The coatings obtained from this electrolyte have very good adhesion if they are followed by quality chemical preparation of the surface. The removal of the oxide film from the aluminum surface has been chemically done in solutions 1 - 4. The influence of current density and deposition time on the structure of copper coatings has been also examined. The morphology and the structural characteristics of copper coatings on aluminum were examined by scanning electron microscopy (SEM).en
dc.description.abstractTaloženje prevlaka bakra na aluminijumu i njegovim legurama vršeno je neposredno elektrohemijskim putem iz rastvora: CuSO4 (55g/dm3) + CH2 NH2 CH2OH (100g/dm3) + (NH4)2SO4 (30g/dm3) + Na2SO4*10H2O (75g/dm3) + Na2CO3 (3g/dm3), temperatura sobna, gustina struje j = 0.3 A/dm2, pH = 10.3. Prevlake bakra dobijene iz ovog elektrolita, uz kvalitetnu hemijsku pripremu površine, imaju dobru adheziju. Uklanjanje oksidne opne sa površine aluminijuma vršeno je hemijskim putem u rastvorima 1-4. Takođe je ispitivan i uticaj gustine struje i vremena taloženja na strukturu prevlaka bakra. Morfologija i strukturne karakteristike prevlaka bakra na aluminijumu ispitivane su skenirajućim elektronskim mikroskopom (SEM).sr
dc.publisherEngineering Society for Corrosion, Belgrade, Serbia
dc.rightsopenAccess
dc.sourceZaštita materijala
dc.subjectelectrochemical deposition of metalsen
dc.subjectcopper coatings on aluminumen
dc.subjectmicrostructureen
dc.subjectscanning electron microscopy (SEM)en
dc.subjectelektrohemijsko taloženje metalasr
dc.subjectprevlake bakra na aluminijumusr
dc.subjectmikrostrukturasr
dc.subjectskenirajuća elektronska mikroskopija (SEM)sr
dc.titleDirect electroplating of copper coatings onto aluminumen
dc.titleNeposredno elektrohemijsko taloženje prevlaka bakra na aluminijumsr
dc.typearticle
dc.rights.licenseBY-NC-ND
dcterms.abstractПавловић, Љубица Ј.; Павловић, Миомир; Томић, Милорад В.; Непосредно електрохемијско таложење превлака бакра на алуминијум; Непосредно електрохемијско таложење превлака бакра на алуминијум;
dc.citation.volume46
dc.citation.issue3
dc.citation.spage13
dc.citation.epage16
dc.citation.other46(3): 13-16
dc.identifier.rcubConv_69
dc.identifier.fulltexthttp://cer.ihtm.bg.ac.rs//bitstream/id/8420/198.pdf
dc.type.versionpublishedVersion


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