Thermal, structural and electrical properties of some bi-cu-ni alloys
Talijan, Nadežda M.
Article (Published version)
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The Bi-Cu-Ni ternary system belongs to the group of potential Cu-Ni-based advanced lead-free solder materials for high temperature application. In this study microstructure investigation of the slow-cooled Bi-Cu-Ni samples was done using SEM-EDS analysis. The samples compositions were chosen along three cross-sections with molar ratio Cu:Ni=1:3, 1:1 and 3:1. The experimentally obtained phase structure was compared with the results of thermodynamic calculation according to CALPHAD method. Also, new results regarding thermal and electrical properties investigations of these alloys are presented in this paper, based on DSC and electroconductivity measurements.
Keywords:Bi-Cu-Ni alloys / lead-free solders / characterization
Source:Archives of Metallurgy and Materials, 2014, 59, 1, 117-120
- Polish Acad Sciences Committee Metallurgy, Krakow
- Advanced multicomponent metal systems and nanostructured materials with diverse functional properties (RS-172037)
- COST Action - MP 0602